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Ion plating is a coating method to promote adhesion of evaporated particles of coating material on to substrates after they have passed through a plasma atmosphere. Some of evaporated particles become ionized in the plasma zone and sputtering effects can be expected on the coating surface and as result high performance thin film coatings can be obtained. These have higher density and stronger adhesion compared to the conventional thin film filter coatings made by vacuum evaporation coating technology. High reliability optical thin film filter products with no wavelength shift are produced by using a unique method.
Concise diagram of Ion plating
 We have developed our own plasma CVD applying the plasma process of our core technology.
Explanation of Plasma CVD
The thin film filter forming method of using condensate from an evaporated target can be divided largely into Physical vapor deposition (PVD) and Chemical vapor deposition (CVD). PVD is a TFF forming method, which condenses the vaporized atoms and molecules, which were created by thermal evaporation or ion impulse sputtering on to a substrate. Evaporation, Ion plating, IBS is one of the types of PVD. On the other hand, CVD is a method to create TFF by solution of vaporized coating material and/or chemical reaction of each molecule at the surface of substrate. Plasma CVD is an example of CVD. Creating TFF by causing plasma in a material gas exciting it into active radicals and/or chemically active ions is generally called plasma CVD.
Feature
Plasma excited gas can undergo very fast reaction under non-equilibrium conditions. It is thus possible to produce a TFF, which has atomic structure and/or composition, which cannot be realized by the thermal excited process.
OCJ produces DLC, which has high durability and high transmittance over IR region by applying our original Ion process method on plasma generation.
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